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Weller announced yesterday the release of two new 80W/24V products desgined to work with their exising power supplies: the WHP80 preheating plate (pictured) and the WSB 80 solder bath.

According to the Weller blog, the preheating plate is used to “slowly increase the temperature of a printed circuit board prior to rework to minimize the risk of damaging sensitive components.”  The solder bath “is used as a rework preparation tool to tin wire ends and to clean and tin component leads.  It can also be used to clean extraneous solder particles…”

I have to admit that I’m not nearly as up-to-date on electronics work as I am with metalworking and woodworking, so maybe some of you can share your opinions about how these new products fit into the Weller line.

The WHP 80 Preheating Plate [Weller Blog]
The WSB 80 Solder Bath [Weller Blog]
[Via]

 

3 Responses to Preview: New Solder Tools From Weller

  1. olderty says:

    Solder of Fortune

  2. Dan says:

    I was more impressed with their thermaboost soldering gun. I love a single tool that does many things. You can use it of course to solder, but also as a hot-knife, engraver or woodburner. If you have to solder something very large, hit the trigger twice and twice the heat comes out! (something like 500deg)

    I was also impressed that there was a blog for nothing but weller topics. One more to subscribe to!

  3. Ovens and hotplates for reflow soldering and surfacemount rework are finally filtering into the hobbyist market! Experimenters have been building their own for years, and this practice finally garnered enough attention that some of the big players have released commercial products. About damn time.

    The basic idea behind preheating is to minimize mechanical stresses caused by thermal gradients across the board during soldering. You pre-warm the whole mess to just a hair below boiling, to drive out any moisture that may have wicked into the edge of the board. After letting it “soak” at that temperature for a while, you ramp up the temperature even further, to just below the solder’s melting point. Then you can easily add a touch more heat to the components you’re working on, and they’ll come free. More importantly, since everything was raised to the same temperature, it doesn’t warp as it cools.

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